Electronic component search and free download site.
Transistors,MosFET ,Diode,Integrated circuits
首页 >>> Central-Semiconductor >>> CPD74 数据手册

CPD74(2004) 数据手册 ( 数据表 ) - Central-Semiconductor

零件编号
产品描述 (功能)
生产厂家
Other PDF
  lastest PDF  
PDF
DOWNLOAD     
CPD74 image

PROCESS DETAILS
   Die Size 25 x 25 MILS
   Die Thickness 6.0 MILS
   Anode 1, 2, 3, 4 Bonding Pad Area 3.5 x 4.0 MILS
   Cathode 1, 2, 3, 4 Bonding Pad Area 3.5 x 4.0 MILS
   Top Side Metalization Al - 12,000Å
   Back Side Metalization Au - 5,000Å

 

零件编号
产品描述 (功能)
PDF
生产厂家
Isolated USB Transceiver with Isolated Power
Linear Technology
Discrete Triacs(Non-Isolated/Isolated)
Sirectifier Electronics
Discrete Triacs(Non-Isolated/Isolated)
Sirectifier Global Corp.
Discrete Triacs(Non-Isolated/Isolated)
Sirectifier Global Corp.
Discrete Triacs(Non-Isolated/Isolated)
Sirectifier Global Corp.
Discrete Triacs (Non-Isolated/Isolated)
Sirectifier Electronics
Discrete Triacs(Non-Isolated/Isolated)
Sirectifier Global Corp.
Discrete Triacs(Non-Isolated/Isolated)
Sirectifier Global Corp.
Discrete Triacs(Non-Isolated/Isolated)
Sirectifier Electronics
Discrete Triacs(Non-Isolated/Isolated)
Sirectifier Electronics

Share Link: 

All Rights Reserved© datasheetq.com  [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]