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CPD80V 数据手册 ( 数据表 ) - Central-Semiconductor

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  2004  
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CPD80V image

PROCESS DETAILS
   Process EPITAXIAL PLANAR
   Die Size 16 x 16 MILS
   Die Thickness 7.1 MILS
   Anode Bonding Pad Area 6.5 x 6.5 MILS
   Top Side Metalization Al - 30,000Å
   Back Side Metalization Au-As - 13,000Å

 

零件编号
产品描述 (功能)
PDF
生产厂家
On-Chip EPROM Microcomputer 4-Bit Single Chip Microprocessor with LCD Driver, 12 Kbytes of EPROM and 1 Kbit of RAM On-Chip
SANYO -> Panasonic
Low-Voltage Single-Chip Microcontrollers with On-Chip PLL and LCD Driver Circuits
SANYO -> Panasonic
ON-CHIP IMAGE DISPLAY CONTROLLER 4-BIT SINGLE-CHIP MICROCONTROLLER FOR VOLTAGE SYNTHESIZER
NEC => Renesas Technology
ON-CHIP IMAGE DISPLAY CONTROLLER 4-BIT SINGLE-CHIP MICROCONTROLLER FOR VOLTAGE SYNTHESIZER
NEC => Renesas Technology
Chip Inductor (Chip Coil) for High Frequency Vertical Wire Wound
Murata Manufacturing
Chip Inductor (Chip Coil) for High Frequency Horizontal Wire Wound
Unspecified
Chip Inductor (Chip Coil)for High Frequency Film Type
Murata Manufacturing
High Efficiency / High Frequency FET plus Driver Multi-chip Module with Internal Voltage Regulator
Fairchild Semiconductor
Flip Chip Protection Diode - Chip Size 0402
Vishay Semiconductors
Single-chip built-in FET type Switching Regulators Output 2A or More High Efficiency Step-down Switching Regulator with Built-in Power MOSFET
ROHM Semiconductor

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