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OPD3030 数据手册 ( 数据表 ) - Kodenshi

零件编号
产品描述 (功能)
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OPD3030
Kodenshi
Kodenshi Auk Co., LTD Kodenshi
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OPD3030 image

HIGH SPEED SENSITIVITY

Structure
1.1 Chip Size : 3.00mm X 3.00mm
1.2 Chip thickness : 400±20um
1.3 Metallization : Top - Al, Bottom - Au
1.4 Passivation : Silicon Oxide
1.5 Bonding Pad Size
   - Anode(top) : 160um X 160um
1.6 Active Area : 2.86mm X 2.86mm

 

零件编号
产品描述 (功能)
PDF
生产厂家
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