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Features: • Ultra Compact Transfer Mold Package • Including Drive and Protection ICs (low and high voltage drive ICs) • Low and High Speed Types • All Mitsubishi DIP and Mini-DIP-IPMs have lead-free terminals • From January 2006 onwards, all DIP and Mini-DIP-IPMs will be supplied with completely lead-free technology
Features: • Employing 5th generation planar IGBT chips with 0.6µm design rule or CSTBT™ technology with superior loss performance • Ultra compact dual or single-in-line transfer mold package (compatible with 2nd generation) • Including driver and protection circuitry (UV, SC) • DIP-IPM with reduction of thermal resistance by 20% • 2500Vrms isolation voltage • High-active interface logic for direct connection to a 3V or 5V MCU • Highest reliability and optimised EMI performance • Available from 3A to 50A / 600V for motor ratings from 0.1kW to 3.7kW • Optional with open emitter topology for vector control • All Mitsubishi DIP and Mini-DIP-IPMs have lead-free terminals • From January 2006 onwards, all DIP and Mini-DIP-IPMs will be supplied with completely lead-free technology
DESCRIPTION The ST62 gang programmers are designed for programming up to 10 EPROM or OTP devices. It can run either in standalone or remote mode under control of a Windows compatible PC. In standalone mode, the target ST62 MCUs are programmed with a simple key operation directly from a master EPROM memory or from a master EPROM MCU. Two color LEDs indicate for each target device the operational pass or fail. Both VERIFY and BLANK CHECK functions are pro vided. In Remote mode, the gang programmer is connected to a PC through an RS232 serial channel. Object code in either S19 or INTEL HEX format is read from disk files to program the target devices. The Windows software also offers VERIFY, BLANK CHECK, READ master and other utility functions. The software allows various user friend ly facilities, such as re-instating the same pro gramming session, user selectable programming steps. The gang programmer is made up of a two parts, a base unit common to all ST62XX devices and a dedicated package adaptator.
HARDWARE FEATURES ■ Programs simultaneously up to 10 ST62Exx EPROM and OTP MCUs ■ Standalone and PC driven modes ■ DIP and SO packages supported
SOFTWARE FEATURES ■ Windows based software ■ S19 or INTEL hex file format
The IRC 1900HT and 4700HT Series is the ultimate combination of precision performance, reliability, and long term stability in a low profile, TaNFilm® DIP and SIP packages. The rugged welded lead construction combined with the inherent passivation characteristics of tantalum nitride film insure superior continuous performance in high temperature applications over the installed life of the part.
· Inherent reliability
· Custom configurations available
· Bonded leads not susceptible to solder reflow problems
· Absolute tolerence to ±0.1% - ratio accuracy to ±0.05%
· Absolute TCR to ±25 ppm/°C - ratio tracking to ±5ppm/°C