HCTS27D/SAMPLE 查看數據表（PDF） - Intersil
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HCTS27D/SAMPLE Datasheet PDF : 9 Pages
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Die Characteristics
DIE DIMENSIONS:
87 x 88 mils
2.20 x 2.24mm
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
B1 (2)
HCTS27MS
HCTS27MS
A1
VCC
C1
(1)
(14)
(13)
A2 (3)
B2 (4)
C2 (5)
(6)
(7)
(8)
Y2
GND
Y3
(12) Y1
(11) C3
(10) B3
(9) A3
Spec Number 518643
437
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