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零件编号
产品描述 (功能)
HCTS30MS 查看數據表(PDF) - Intersil
零件编号
产品描述 (功能)
生产厂家
HCTS30MS
Radiation Hardened 8-Input NAND Gate
Intersil
HCTS30MS Datasheet PDF : 10 Pages
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Die Characteristics
DIE DIMENSIONS:
87 x 88 mils
METALLIZATION:
Type: SiAl
Metal Thickness: 11k
Å
±
1k
Å
GLASSIVATION:
Type: SiO
2
Thickness: 13k
Å
±
2.6k
Å
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
µ
m x 100
µ
m
4 mils x 4 mils
Metallization Mask Layout
HCTS30MS
HCTS30MS
A
VCC
NC
(1)
(14)
(13)
B (2)
C (3)
(12) H
(11) G
D (4)
(10) NC
E (5)
(9) NC
(6)
(7)
(8)
F
GND
Y
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS30 is TA14428A.
Spec Number
518639
448
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