M28R400CT100D16 查看數據表（PDF） - STMicroelectronics
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M28R400CT100D16
STMicroelectronics
M28R400CT100D16 Datasheet PDF : 11 Pages
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M28R400CT-KGD, M28R400CB-KGD
Table 8. Pad Extraction
Pad
Pad
Number Function
Pad Placement
X
Y
Pad
Pad
Number Function
Pad Placement
X
Y
1
A15
–1612.24
1068.60
24
VSS
1385.72
–1023.68
2
A14
–1477.72
1068.60
25
G
1266.60
–1023.68
3
A13
–1315.88
1068.60
26
DQ0
1141.00
–1023.68
4
A12
–1190.28
1068.60
27
DQ8
1008.92
–1023.68
5
A11
–1071.16
1068.60
28
DQ1
889.80
–1023.68
6
A10
–945.56
1068.60
29
DQ9
757.72
–1023.68
7
A9
–783.72
1068.60
30
DQ2
638.80
–1023.68
8
A8
–658.12
1068.60
31
DQ10
506.52
–1023.68
9
W
–539.00
1068.60
32
DQ3
387.40
–1023.68
10
RP
–377.16
1068.60
33
DQ11
255.32
–1023.68
11
VPP
249.16
1068.60
34
VDD
136.20
–1023.68
12
WP
374.76
1068.60
35
DQ4
–255.08
–1023.68
13
NC
536.60
1068.60
36
DQ12
–387.16
–1023.68
14
A17
655.72
1068.60
37
DQ5
–506.28
–1023.68
15
A7
781.32
1068.60
38
DQ13
–638.36
–1023.68
16
A6
943.16
1068.60
39
DQ6
–757.48
–1023.68
17
A5
1068.76
1068.60
40
DQ14
–889.56
–1023.68
18
A4
1187.88
1068.60
41
DQ7
–1008.68 –1023.68
19
A3
1313.48
1068.60
42
DQ15
–1140.76 –1023.68
20
A2
1475.32
1068.60
43
NC
–1266.36 –1023.68
21
A1
1609.84
1068.60
44
VSS
–1385.48 –1023.68
22
A0
1636.92
–1023.68
45
VDDQ
–1504.60 –1023.68
23
E
1504.84
–1023.68
46
A16
–1636.68 –1023.68
Note: 1. All pad placements are referred to the center of the chip and center of the pad. The coordinates can be used to operate wire bonding
equipment.
2. NC = Pad not connected.
3. Dimensions are given in microns.
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