NCV8664
160
140
120
100
80
60
40
20
0
0
SOIC−8 Fused
SOT223
DPAK
100 200 300 400 500 600 700
COPPER AREA (mm2)
Figure 28. qJA vs. Copper Spreader Area
1000
100
SOT223
SOIC−8 Fused
10
DPAK
1
0.1
0.01
0.001
0.000001 0.00001
0.0001
0.001
0.01
0.1
1
10
PULSE TIME (sec)
Figure 29. Single−Pulse Heating Curves
100
1000
ORDERING INFORMATION
Device*
NCV8664D50R2G
Marking
V6645
Package
SOIC−8 Fused
(Pb−Free)
Shipping†
2500 / Tape & Reel
NCV8664D50G
V6645
SOIC−8 Fused
(Pb−Free)
98 Units / Rail
NCV8664DT50RKG
V66450G
DPAK
(Pb−Free)
2500 / Tape & Reel
NCV8664DT33RKG
V66433G
DPAK
(Pb−Free)
2500 / Tape & Reel
NCV8664ST50T3G
V6645
SOT−223
(Pb−Free)
4000 / Tape & Reel
NCV8664ST33T3G
V6643
SOT−223
(Pb−Free)
4000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
www.onsemi.com
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