Package information
Table 10. QFN20 package mechanical data
Dimensions in mm
Ref
Min
Typ
A
0.8
0.9
A1
0.02
A2
0.65
A3
0.25
b
0.18
0.23
D
3.85
4
D2
2.6
E
3.85
4
E2
2.6
e
0.45
0.5
L
0.3
0.4
ddd
Figure 48. QFN20 package footprint
TS2012
Max
1
0.05
1
0.3
4.15
4.15
0.55
0.5
0.08
FOOTPRINT DATA (mm)
A
4.55
B
4.55
C
0.50
D
0.35
E
0.65
F
2.45
G
0.40
Note:
The QFN20 package has an exposed pad E2 x D2. For enhanced thermal performance, the
exposed pad must be soldered to a copper area on the PCB, acting as a heatsink. This
copper area can be electrically connected to pin 4, 12, 18 (PGND, AGND) or left floating.
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