µ PD160062
11. RECOMMENDED MOUNTING CONDITIONS
The following conditions must be met for soldering conditions of the µ PD160062.
For more details, refer to the Semiconductor Device Mount Manual
(http://www.necel.com/pkg/en/mount/index.html).
Please consult with our sales offices in case other soldering process is used, or in case the soldering is done under
different conditions.
µ PD160062N-×××: TCP (TAB package)
Mounting Condition
Mounting Method
Thermocompression Soldering
ACF
(Adhesive Conductive
Film)
Condition
Heating tool 300 to 350°C, heating for 2 to 3 seconds, pressure 100g (per
solder)
Temporary bonding 70 to 100°C, pressure 3 to 8 kg/cm2, time 3 to 5 seconds.
Real bonding 165 to 180°C, pressure 25 to 45 kg/cm2, time 30 to 40 seconds.
(When using the anisotropy conductive film SUMIZAC1003 of Sumitomo
Bakelite, Ltd.)
Caution To find out the detailed conditions for packaging the ACF part, please contact the ACF
manufacturing company. Be sure to avoid using two or more packaging methods at a time.
Data Sheet S16449EJ1V0DS
17