UPD16641N 查看數據表（PDF） - NEC => Renesas Technology
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UPD16641N Datasheet PDF : 20 Pages
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µPD16641
10. RECOMMENDED MOUNTING CONDITIONS
Mounting this product under the following conditions is recommended.
For the mounting methods and conditions other than those recommended, consult NEC.
Mounting Conditions
Thermocompression bonding
Mounting Method
Soldering
ACF (sheet adhesive)
Conditions
Heating tool: 300 to 350°C, Heating time: 2 to 3 seconds,
Pressure: 100 g (per product)
Preliminary adhesion: 70 to 100°C, Pressure: 3 to 8 kg/cm2,
Time: 3 to 5 seconds
Real adhesion: 165 to 180°C, Pressure: 25 to 45 kg/cm2, Time 30 to
40 seconds (when SUMIZAC1003 of Sumitomo Bakelite is used)
Note For the mounting conditions for ACF, consult the ACF manufacturer.
Do not use two or more mounting methods in combination.
Reference
NEC Semiconductor Device Reliability/Quality Control System (C10983E)
Quality Grades to NEC’s Semiconductor Devices (C11531E)
17
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