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WED3C7410E16M400BH9M 查看數據表(PDF) - White Electronic Designs Corporation
零件编号
产品描述 (功能)
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WED3C7410E16M400BH9M
7410E RISC Microprocessor HiTCE™ Multichip Package
White Electronic Designs Corporation
WED3C7410E16M400BH9M Datasheet PDF : 15 Pages
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White Electronic Designs
WED3C7410E16M-XBHX
PRELIMINARY
FIGURE 5 – PIN ASSIGNMENTS
Ball assignments of the 255 CBGA package as viewed from the top surface.
Side profile of the CBGA package to indicate the direction of the top surface view.
July 2004
Rev. 0
4
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
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