S8GCM6G(Ver_A13) 查看數據表（PDF） - TSC Corporation
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S8GCM6G Datasheet PDF : 3 Pages
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PACKAGE OUTLINE DIMENSIONS
S8GC thru S8MC
Taiwan Semiconductor
DIM.
A
B
C
D
E
F
G
H
Unit(mm)
Min Max
2.90 3.20
6.60 7.11
5.59 6.22
2.00 2.62
1.00 1.60
7.75 8.13
0.10 0.20
0.15 0.31
Unit(inch)
Min Max
0.114 0.126
0.260 0.280
0.220 0.245
0.079 0.103
0.039 0.063
0.305 0.320
0.004 0.008
0.006 0.012
SUGGESTED PAD LAYOUT
MARKING DIAGRAM
P/N
G
YW
F
Symbol
A
B
C
D
E
= Specific Device Code
= Green Compound
= Date Code
= Factory Code
Unit(mm)
3.3
2.5
6.8
4.4
9.4
Document Number：1307006
Version:A13
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