HCS32D(1999) 查看數據表（PDF） - Intersil

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HCS32D
(Rev.:1999)

Radiation Hardened Quad 2-Input OR Gate

Intersil 

Die Characteristics

DIE DIMENSIONS:

87 x 88 mils

2.20 x 2.2mm

METALLIZATION:

Type: SiAl

Metal Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13kÅ ± 2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100µm x 100µm

4 x 4 mils

Metallization Mask Layout

HCS32MS

HCS32MS

A1

VCC

B4

(1)

(14)

(13)

B1 (2)

Y1 (3)

A2 (4)

B2 (5)

(6)

(7)

(8)

Y2

GND

Y3

80

(12) A4

(11) Y4

(10) B3

(9) A3

Spec Number 518768

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