Ordering Information
Part Number
Package
H11AG1M
DIP 6-Pin
H11AG1SM
H11AG1SR2M
H11AG1VM
H11AG1SVM
H11AG1SR2VM
H11AG1TVM
SMT 6-Pin (Lead Bend)
SMT 6-Pin (Lead Bend)
DIP 6-Pin, DIN EN/IEC60747-5-5 Option
SMT 6-Pin (Lead Bend), DIN EN/IEC60747-5-5 Option
SMT 6-Pin (Lead Bend), DIN EN/IEC60747-5-5 Option
DIP 6-Pin, 0.4” Lead Spacing, DIN EN/IEC60747-5-5 Option
Packing Method
Tube (50 Units)
Tube (50 Units)
Tape and Reel (1000 Units)
Tube (50 Units)
Tube (50 Units)
Tape and Reel (1000 Units)
Tube (50 Units)
Marking Information
1
H11AG1 2
V X YY Q 6
3
4
5
Figure 12. Top Mark
Table 1. Top Mark Definitions
1
Fairchild Logo
2
Device Number
3
DIN EN/IEC60747-5-5 Option (only appears on component ordered with this option)
4
One-Digit Year Code, e.g., “5”
5
Digit Work Week, Ranging from “01” to “53”
6
Assembly Package Code
©2007 Fairchild Semiconductor Corporation
H11AG1M Rev. 1.4
9
www.fairchildsemi.com