AD9430/PCB-CMOS 查看數據表（PDF） - Analog Devices
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AD9430/PCB-CMOS Datasheet PDF : 20 Pages
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AD9430
PRELIMINARY TECHNICAL DATA
Troubleshooting
If the board does not seem to be working correctly, try the following:
• Verify power at IC pins.
• Check that all jumpers are in the correct position for the
desired mode of operation.
• Verify VREF is at 1.23 V.
• Try running Encode Clock and Analog Inputs at low speeds
(10 MSPS/1 MHz) and monitor 574, DAC, and ADC outputs
for toggling.
The AD9430 Evaluation Board is provided as a design example
for customers of Analog Devices, Inc. ADI makes no warranties,
express, statutory, or implied, regarding merchantability or
fitness for a particular purpose.
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
100-Lead TQFP (with Exposed Heat Sink)
(TQFP-100)
0.047 (1.20)
MAX
0.030 (0.75)
0.630 (16.00) SQ
0.551 (14.00) SQ
0.024 (0.60)
100
76
0.018 (0.45)
1
75
SEATING
PLANE
76
100
75
1
BOTTOM VIEW
TOP VIEW
(PINS DOWN)
25
26
0.006 (0.15)
0.002 (0.05)
0.0197 (0.50)
BSC
50
49
0.041 (1.05)
0.039 (1.00)
0.037 (0.95)
0.011 (0.27) 7؇
0.009 (0.22) 0؇
0.007 (0.17)
50
49
CONDUCTIVE
HEAT SINK
25
26
0.260 (6.00) NOM
CONTROLLING DIMENSIONS ARE IN MILLIMETERS.
CENTER FIGURES ARE TYPICAL UNLESS
OTHERWISE NOTED.
NOTE:
THE AD9430 HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION OF
THE DEVICE OVER THE FULL INDUSTRIAL TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF
THE PACKAGE AND ELECTRICALLY CONNECTED TO CHIP GROUND. IT IS RECOMMENDED THAT NO PCB SIGNAL
TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE
SLUG. ATTACHING THE SLUG TO A GROUND PLANE WILL REDUCE THE JUNCTION TEMPERATURE OF THE DEVICE
WHICH MAY BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS.
-20-
4/01/2002 REV. PrG
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