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零件编号
产品描述 (功能)
HCTS365D 查看數據表(PDF) - Intersil
零件编号
产品描述 (功能)
生产厂家
HCTS365D
Radiation Hardened Hex Buffer/Line Driver Non-Inverting
Intersil
HCTS365D Datasheet PDF : 10 Pages
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HCTS365MS
Die Characteristics
DIE DIMENSIONS:
108 x 106 mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11k
Å
±
1k
Å
GLASSIVATION:
Type: SiO
2
Thickness: 13k
Å
±
2.6k
Å
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
µ
m x 100
µ
m
4 mils x 4 mils
Metallization Mask Layout
Y1
A1
(3)
(2)
HCTS365MS
OE1
(1)
VCC
(16)
OE2
(15)
A2 (4)
Y2 (5)
NC
A3 (6)
NC
(14) A6
(13) Y6
(12) A5
(11) Y5
NC
(7)
Y3
(8)
NC
GND
(9)
(10)
Y4
A4
NOTE: The die diagram is a generic plot form a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS365 is TA14413A.
Spec Number
518637
10
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