HCTS14D(1995) 查看數據表（PDF） - Intersil
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HCTS14D Datasheet PDF : 8 Pages
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Die Characteristics
DIE DIMENSIONS:
87 x 88 mils
2,20 x 2.24mm
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 x 4 mils
Metallization Mask Layout
HCTS14MS
HCTS14MS
A1
VCC
A6
(1)
(14)
(13)
Y1 (2)
A2 (3)
(12) Y6
(11) A5
Y2 (4)
(10) Y5
A3 (5)
(9) A4
(6)
(7)
(8)
Y3
GND
Y4
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS14 is TA14443A.
Spec Number 518607
397
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