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E-L6219DSA 查看數據表(PDF) - STMicroelectronics

零件编号
产品描述 (功能)
生产厂家
E-L6219DSA
ST-Microelectronics
STMicroelectronics ST-Microelectronics
E-L6219DSA Datasheet PDF : 15 Pages
First Prev 11 12 13 14 15
L6219DSA
4
Package information
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 6. SO24 mechanical data and package dimensions
DIM.
MIN.
mm
TYP.
MAX. MIN.
inch
TYP. MAX.
A 2.35
2.65 0.093
0.104
A1 0.10
0.30 0.004
0.012
B 0.33
0.51 0.013
0.200
C 0.23
0.32 0.009
0.013
D (1) 15.20
15.60 0.598
0.614
E 7.40
7.60 0.291
0.299
e
1.27
0.050
H 10.0
10.65 0.394
0.419
h 0.25
0.75 0.010
0.030
L 0.40
1.27 0.016
0.050
k
0˚ (min.), 8˚ (max.)
ddd
0.10
0.004
(1) “D” dimension does not include mold flash, protusions or gate
burrs. Mold flash, protusions or gate burrs shall not exceed
0.15mm per side.
OUTLINE AND
MECHANICAL DATA
Weight: 0.60gr
SO24
0070769 C
13/15

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