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CXB1454R 查看數據表(PDF) - Sony Semiconductor

零件编号
产品描述 (功能)
生产厂家
CXB1454R
Sony
Sony Semiconductor Sony
CXB1454R Datasheet PDF : 17 Pages
First Prev 11 12 13 14 15 16 17
Package Outline
Unit: mm
48
49
64PIN LQFP (PLASTIC)
16.0 ± 0.2
14.0 ± 0.1
33
32
1.7MAX
0.1
CXB1454R
64
1
0.8
+ 0.08
0.37 – 0.07
0.25
0.1 ± 0.1
17
16
0.13 M
B
A
+ 0.08
0.37 – 0.07
(0.35)
0° to 10°
DETAIL A
DETAIL B
NOTE: Dimension “” does not include mold protrusion.
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
SONY CODE
LQFP-64P-L02
LEAD TREATMENT
PALLADIUM PLATING
EIAJ CODE
LQFP064-P-1414
LEAD MATERIAL
COPPER ALLOY
JEDEC CODE
PACKAGE MASS
0.7g
NOTE : PALLADIUM PLATING
This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).
– 17 –
Sony Corporation

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