ADM1062ACPZ 查看數據表（PDF） - Analog Devices
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ADM1062ACPZ Datasheet PDF : 35 Pages
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Data Sheet
OUTLINE DIMENSIONS
PIN 1
INDICATOR
6.10
6.00 SQ
5.90
0.50
BSC
0.30
0.25
0.18
31
40
30
1
EXPOSED
PAD
PIN 1
INDICATOR
4.25
4.10 SQ
3.95
0.80
0.75
0.70
SEATING
PLANE
TOP VIEW
21
10
0.45
0.40
20
11
BOTTOM VIEW
0.25 MIN
0.35
0.05 MAX
0.02 NOM
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COPLANARITY
0.08
0.20 REF
ORDERING GUIDE
Model1
ADM1062ACPZ
ADM1062ACPZ-REEL7
ADM1062ASUZ
ADM1062ASUZ-REEL7
EVAL-ADM1062TQEBZ
1 Z = RoHS Compliant Part.
COMPLIANT TO JEDEC STANDARDS MO-220-WJJD.
Figure 51. 40-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
6 mm × 6 mm Body, Very Very Thin Quad
(CP-40-9)
Dimensions shown in millimeters
0.75
1.20
MAX
0.60
0.45
9.00
BSC SQ
48
1
37
36
1.05
1.00
0.95
0.15
0.05
0° MIN 0.20
0.09
7°
3.5°
SEATING
PLANE
0°
0.08 MAX
COPLANARITY
VIEW A
ROTATED 90° CCW
PIN 1
TOP VIEW
(PINS DOWN)
7.00
BSC SQ
12
13
25
24
VIEW A 0.50
0.27
BSC
LEAD PITCH
0.22
0.17
COMPLIANT TO JEDEC STANDARDS MS-026ABC
Figure 52. 48-Lead Thin Plastic Quad Flat Package [TQFP]
(SU-48)
Dimensions shown in millimeters
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
40-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
40-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
48-Lead Thin Plastic Quad Flat Package [TQFP]
48-Lead Thin Plastic Quad Flat Package [TQFP]
Evaluation Kit (TQFP Version)
ADM1062
Package Option
CP-40-9
CP-40-9
SU-48
SU-48
I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
©2005–2015 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04433-0-1/15(D)
Rev. D | Page 35 of 35
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