MKT1820727066MG 查看數據表（PDF） - Vishay Semiconductors
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MKT1820727066MG Datasheet PDF : 17 Pages
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www.vishay.com
MKT1820
Vishay Roederstein
HEAT CONDUCTIVITY (G) AS A FUNCTION OF CAPACITOR BODY THICKNESS IN mW/°C
Wmax.
(mm)
HEAT CONDUCTIVITY (mW/°C)
PITCH 10.0 mm PITCH 15.0 mm PITCH 22.5 mm PITCH 27.5 mm PITCH 37.5 mm PITCH 52.5 mm
3.5
5.0
-
-
-
-
-
4.0
6.0
-
-
-
-
-
4.5
7.0
-
-
-
-
-
5.5
8.0
10.0
-
-
-
-
6.5
10.0
13.0
20.0
-
-
-
7.5
-
15.0
22.0
-
-
-
8.5
-
16.0
24.0
-
-
-
9.0
-
-
-
32.0
-
-
10.5
-
-
30.0
-
-
-
11.0
-
-
-
38.0
-
-
11.5
-
-
-
38.0
-
-
12.5
-
-
34.0
-
-
-
13.0
-
-
-
45.0
-
-
13.5
-
-
-
45.0
-
-
15.0
-
-
-
50.0
-
-
16.5
-
-
-
58.0
-
-
18.0
-
-
-
60.0
-
-
18.5
-
-
-
-
90.0
-
20.0
-
-
-
73.0
-
-
21.0
-
-
-
70.0
-
-
21.5
-
-
-
-
102.0
-
24.0
-
-
-
-
118.0
-
25.0
-
-
-
-
-
155.0
30.0
-
-
-
-
135.0
170.0
35.0
-
-
-
-
-
200.0
POWER DISSIPATION AND MAXIMUM COMPONENT TEMPERATURE RISE
The power dissipation must be limited in order not to exceed the maximum allowed component temperature rise as a function
of the free air ambient temperature.
The component temperature rise (T) can be measured or calculated by T = P/G:
• T = component temperature rise (°C) with a maximum of 15 °C
• P = power dissipation of the component (mW)
• G = heat conductivity of the component (mW/°C)
MEASURING THE COMPONENT TEMPERATURE
A thermocouple must be attached to the capacitor body as in:
Thermocouple
The temperature is measured in unloaded (Tamb) and maximum loaded condition (TC).
The temperature rise is given by T = TC - Tamb.
To avoid thermal radiation or convection, the capacitor must be tested in a closed area from air circulation.
Revision: 02-Feb-18
12
Document Number: 26011
For technical questions, contact: dc-film@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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