28C256 查看數據表（PDF） - Atmel Corporation

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28C256

256K (32K x 8) Paged CMOS E2PROM

Atmel Corporation 

28D6

28F

32J

32L

28P6

28S

28T

28U

W

Blank

E

F

Package Type

28 Lead, 0.600" Wide, Non-Windowed, Ceramic Dual Inline Package (Cerdip)

28 Lead, Non-Windowed, Ceramic Bottom-Brazed Flat Package (Flatpack)

32 Lead, Plastic J-Leaded Chip Carrier (PLCC)

32 Pad, Non-Windowed, Ceramic Leadless Chip Carrier (LCC)

28 Lead, 0.600" Wide, Plastic Dual Inline Package (PDIP)

28 Lead, 0.300" Wide, Plastic Gull Wing Small Outline (SOIC)

28 Lead, Plastic Thin Small Outline Package (TSOP)

28 Pin, Ceramic Pin Grid Array (PGA)

Die

Options

Standard Device: Endurance = 10K Write Cycles; Write Time = 10 ms

High Endurance Option: Endurance = 100K Write Cycles

Fast Write Option: Write Time = 3 ms

2-230

AT28C256

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