82541ER 查看數據表（PDF） - Intel
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82541ER Datasheet PDF : 51 Pages
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5.0
5.1
82541ER Gigabit Ethernet Controller
Package and Pinout Information
This section describes the device physical characteristics. The pin number-to-signal mapping is
indicated beginning with Table 25.
Package Information
The 82541ER device is a 196-lead plastic ball grid array (BGA) measuring 15 mm by 15 mm. The
package dimensions are detailed below. The nominal ball pitch is 1 mm.
1.56 +/-0.19
0.85
30 o
0.32 +/-0.04
0.40 +/-0.10
Figure 11. 82541ER Mechanical Specifications
Seating Plate
Note: No changes to existing soldering processes are needed for the 0.32 mm substrate change.
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