VSC8102 查看數據表（PDF） - Vitesse Semiconductor

零件编号

产品描述 (功能)

生产厂家

VSC8102

155.52 Mb/s Clock and Data Recovery Units

Vitesse Semiconductor 

VITESSE

VSC8101/8102

Preliminary Data Sheet

155.52 Mb/s Clock and

Data Recovery Units

Thermal Characteristics of the VSC8101 and VSC8102 Packages

VSC8101

The VSC8101 is packaged in a 28PLCC, with an internal heat spreader for improved heat dissipation. With

natural convection, the Case to Air Thermal Resistance (θ CA)is estimated to be 65oC/W.

VSC8102

The VSC8102 is packaged in a thermally enhanced 100PQFP with an embedded heat spreader. The heat

spreader surface area is shown in figure 9. With natural convection, the Case to Air Thermal Resistance (θ CA)is

estimated to be 27.5oC/W. The Air Flow versus Thermal Resistance relationship is shown in the following

table:

Table 6: θ CA Versus Air Velocity for the VSC8102 Package

Air Velocity (LFPM)

0

100

200

400

600

Case to Air Thermal Resistance (oC/W)

27.5

23.1

19.8

17.6

16

G52087-0 Rev. 1.3

® VITESSE Semiconductor Corporation

Page 13

Share Link: