+3.3V, 2.488Gbps, SDH/SONET
1:16 Deserializer with Clock Recovery
50Ω termination (Figure 5). AC-coupling is also
required to maintain the input common-mode level.
Exposed-Pad Package
The exposed-pad (EP), 64-pin TQFP incorporates fea-
tures that provide a very low thermal-resistance path for
heat removal from the IC. The pad is electrical ground
on the MAX3881 and must be soldered to the circuit
board for proper thermal and electrical performance.
Layout Techniques
For best performance, use good high-frequency layout
techniques. Filter voltage supplies, keep ground con-
nections short, and use multiple vias where possible.
Use controlled-impedance transmission lines to inter-
face with the MAX3881 high-speed inputs and outputs.
Power-supply decoupling should be placed as close to
VCC pins as possible. To reduce feedthrough, take
care to isolate the input signals from the output signals.
VCC
0.1µF 25Ω
SDI+
PECL
LEVELS
0.1µF
100Ω
25Ω
SDI-
50Ω 50Ω
MAX3881
Figure 5. Interfacing with PECL Input Levels
MAX3881
3.3V
PHADJ+ (PIN 5)
Chip Information
TRANSISTOR COUNT: 2231
PROCESS: BiPolar
PHADJ- (PIN 6)
Figure 4. Phase-Adjust Resistor-Divider
8 _______________________________________________________________________________________