MAX9927 查看數據表（PDF） - Maxim Integrated

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MAX9927

Variable Reluctance Sensor Interfaces with Differential Input and Adaptive Peak Threshold

Maxim Integrated 

Variable Reluctance Sensor Interfaces with

Differential Input and Adaptive Peak Threshold

ABSOLUTE MAXIMUM RATINGS

VCC to GND .............................................................-0.3V to + 6V

All Other Pins..............................................-0.3V to (VCC + 0.3V)

Current into IN+, IN-, IN_+, IN_-.......................................±40mA

Current into All Other Pins ................................................±20mA

Output Short-Circuit (OUT_, OUT) to GND.............................10s

Continuous Power Dissipation (TA = +70°C) (Note 1)

10-Pin µMAX (derate 8.8mW/°C above +70°C) ........707.3mW

16-Pin QSOP (derate 9.6mW/°C above +70°C)........771.5mW

Operating Temperature Range .........................-40°C to +125°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow) .......................................+260°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

PACKAGE THERMAL CHARACTERISTICS (Note 1)

µMAX

Junction-to-Ambient Thermal Resistance (θJA) ......113.1°C/W

Junction-to-Case Thermal Resistance (θJC) ................42°C/W

QSOP

Junction-to-Ambient Thermal Resistance (θJA) ......103.7°C/W

Junction-to-Case Thermal Resistance (θJC) ................37°C/W

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

ELECTRICAL CHARACTERISTICS

(VCC = 5V, VGND = 0V, MAX9925/MAX9927 gain setting = 1V/V, Mode A1, VBIAS = 2.5V, VPULLUP = 5V, RPULLUP = 1kΩ, CCOUT =

50pF. TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Note 2)

PARAMETER

SYMBOL

CONDITIONS

MIN

POWER SUPPLY

Operating Supply Range

VCC

(Note 3)

4.5

Supply Current

MAX9924/MAX9925

ICC

MAX9926/MAX9927

Power-On Time

PON

VCC > VUVLO = 4.1V, step time for VCC

~ 1µs

INPUT OPERATIONAL AMPLIFIER (MAX9925/MAX9927)

Input Voltage Range

IN+, IN-

Guaranteed by CMRR

0

Input Offset Voltage

VOS-OA

Temperature drift

Input Bias Current

Input Offset Current

Common-Mode Rejection Ratio

Power-Supply Rejection Ratio

Output Voltage Low

Output Voltage High

IBIAS

IOFFSET

CMRR

PSRR

VOL

VOH

(Note 4)

(Note 4)

From VCM = 0 to VCC

MAX9925

MAX9927

IOL = 1mA

IOH = -1mA

75

88

77

VCC -

0.050

TYP

2.6

4.7

30

0.5

0.1

0.05

102

105

94

MAX UNITS

5.5

V

5

mA

10

150

µs

VCC

V

5

µV/°C

3

mV

6

nA

2

nA

dB

dB

0.050

V

V

Recovery Time from Saturation

Gain-Bandwidth Product

Slew Rate

Charge-Pump Frequency

tSAT

GBW

SR

fCP

To 1% of the actual VOUT after output

saturates

1.2

µs

1.4

MHz

2.3

V/µs

1.3

MHz

2 _______________________________________________________________________________________

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