FEDL64168-01
Semiconductor
PACKAGE DIMENSIONS
ML64168-XXXTB
60
61
ML64168
41
40
0.17±0.05
0.10 SEATING PLANE
1.0±0.2
80
INDEX MARK
1
1.25TYP.
0.5
21
20
0.22 +-00..0078
0.10 M
0~10°
0.5±0.2
0.6TYP.
Figure C-3 80-Pin QFP:TB Package Dimension Diagram
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are
very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product
name, package name, pin number, package code and desired mounting conditions (reflow method,
temperature and times).
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