SC18IM700 查看數據表（PDF） - NXP Semiconductors.
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SC18IM700 Datasheet PDF : 24 Pages
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NXP Semiconductors
SC18IM700
Master I2C-bus controller with UART interface
14.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 19) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 14 and 15
Table 14. SnPb eutectic process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350
350
< 2.5
235
220
2.5
220
220
Table 15. Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
< 1.6
260
260
1.6 to 2.5
260
250
> 2.5
250
245
> 2000
260
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 19.
SC18IM700_3
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 12 October 2017
© NXP Semiconductors N.V. 2017. All rights reserved.
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