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UPD17P709GC-3B9 查看數據表(PDF) - NEC => Renesas Technology

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UPD17P709GC-3B9 Datasheet PDF : 38 Pages
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DATA SHEET
MOS INTEGRATED CIRCUIT
µPD17P709
4-BIT SINGLE-CHIP MICROCONTROLLER WITH
BUILT-IN HARDWARE DEDICATED TO DIGITAL TUNING SYSTEMS
The µPD17P709 is produced by replacing the built-in masked ROM of the µPD17704Note, µPD17705Note,
µPD17707, µPD17708, and µPD17709 with a one-time PROM.
The µPD17P709 allows programs to be written once, so that the µPD17P709 is suitable for preproduction in
µPD17704, µPD17705, µPD17707, µPD17708, or µPD17709 system development or low-volume production.
When reading this document, also refer to the publications on the µPD17704, µPD17705, µPD17707,
µPD17708, or µPD17709.
Note Under development
The electrical characteristics (including power supply currents) and PLL analog characteristics of
the µPD17P709 differ from those of the µPD17704, µPD17705, µPD17707, µPD17708, and µPD17709. In
high-volume application set production, carefully check those differences.
FEATURES
Compatible with the µPD17704, µPD17705, µPD17707, µPD17708, and µPD17709
Built-in one-time PROM : 32K bytes (16384 × 16 bits)
Supply voltage
: VDD = 5 V ±10%
ORDERING INFORMATION
Part number
µPD17P709GC-3B9
Package
80-pin plastic QFP (14 × 14 mm, 0.65-mm pitch)
The information in this document is subject to change without notice.
Document No. U10142EJ2V0DS00 (2nd edition)
Date Published November 1996 P
Printed in Japan
The mark shows major revised points.
©
1995

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