FMM5061VF 查看數據表（PDF） - Unspecified

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FMM5061VF

X-Band Power Amplifier MMIC

Unspecified 

FMM5061VF

X-Band Power Amplifier MMIC

■ Mounting Instructions for VF Package

1. Screw Mounting

(1) The flange of package may be attached using screws. Torque conditions are

shown in table 1.

Table 1. Recommended and Maximum Torque for Screw Mounting

Package

VF

Recommended

screw

M2.0

Recommended

Torque

Maximum Torque

10 N-cm (0.9 lb-in) 15 N-cm (1.3 lb-in)

(2) First, tighten the screws with a torque driver set to 5 N-cm.

(3) The surface finish of the heat sink should be better than 0.8 µm, and the

surface flatness must be better than 10 µm.

(4) Silicon based heat sink compounds should not be used for thermal

conductive grease. They cause poor grounding of the source flange,

contamination and long term degradation of thermal resistance between the

FET package and heat sink.

2. Solder Mounting

(1) Recommended solder are Tin-Lead solder (63Sn/37Pb), Lead-Free solder

(Sn-3.0Ag-0.5Cu)*1 or equivalent.

(2) For soldering, Tin-Lead solder (63Sn/37Pb) or Lead-Free solder

(Sn-3.0Ag-0.5Cu)*1 shall be used. (*1: The figure displays with weight %. A

predominantly tin-rich alloy with 3.0% silver and 0.5% copper.)

(3) Recommended Flux is Rosin type with chlorine content: 0.2% or less and a low

halogen content. After soldering, the flux residue should be removed by

appropriate cleaning methods.

(4) The recommended soldering conditions are as follows:

Partial heating method (soldering iron, spot laser/air)

Product terminal temperature: 260 deg-C, max. 10 s./terminal

or 400 deg-C, max. 3 s./terminal

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