MF1S5009DA4 查看數據表（PDF） - NXP Semiconductors.
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MF1S5009DA4
NXP Semiconductors.
MF1S5009DA4 Datasheet PDF : 32 Pages
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NXP Semiconductors
MF1S5009
Mainstream contactless smart card IC
Table 20.
Name
Cmd
Addr
CRC
NAK
MIFARE Transfer command
Code
Description
B0h
Write value into destination block
-
MIFARE destination block address
(00h to FFh)
-
CRC according to Ref. 4
see Table 9
see Section 10.3
Length
1 byte
1 byte
2 bytes
4-bit
Table 21. MIFARE Transfer timing
These times exclude the end of communication of the PCD.
Transfer
TACK min
71 μs
TACK max
TTimeOut
TNAK min
71 μs
TNAK max
TTimeOut
TTimeOut
10 ms
12. Limiting values
Table 22. Limiting values [1][2]
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Min
II
Ptot/pack
Tstg
Tamb
VESD
Ilu
input current
total power dissipation per package
storage temperature
ambient temperature
electrostatic discharge voltage
latch-up current
-
-
−55
−25
[3] 2
±100
Max
30
200
+125
+70
-
-
Unit
mA
mW
°C
°C
kV
mA
[1] Stresses above one or more of the limiting values may cause permanent damage to the device
[2] Exposure to limiting values for extended periods may affect device reliability
[3] MIL Standard 883-C method 3015; Human body model: C = 100 pF, R = 1.5 kΩ
13. Characteristics
Table 23. Characteristics [1][2]
Symbol Parameter
Conditions
Ci
input capacitance
fi
input frequency
EEPROM characteristics
tret
Nendu(W)
retention time
write endurance
Tamb = 22 °C
Tamb = 22 °C
Min
[3] 15.0
-
Typ
Max
17.0
19.0
13.56 -
10
-
-
100000 200000 -
[1] Stresses above one or more of the values may cause permanent damage to the device.
[2] Exposure to limiting values for extended periods may affect device reliability.
[3] LCR meter, Tamb = 22 °C, fi = 13.56 MHz, 2.8 V RMS.
Unit
pF
MHz
year
cycle
MF1S5009
Product data sheet
PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 27 July 2010
189131
© NXP B.V. 2010. All rights reserved.
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