NXP Semiconductors
MF1SPLUSx0y1
Mainstream contactless smart card IC
16. Tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Quick reference data . . . . . . . . . . . . . . . . . . . . .2
Ordering information . . . . . . . . . . . . . . . . . . . . .3
Bonding pad assignments to smart card
contactless module . . . . . . . . . . . . . . . . . . . . . .4
ISO/IEC 14443-3 . . . . . . . . . . . . . . . . . . . . . . . .9
ISO/IEC 14443-4 . . . . . . . . . . . . . . . . . . . . . . .10
Table 6. Security level 0 command overview . . . . . . . . 10
Table 7. Security level 1 command overview . . . . . . . . 10
Table 8. Security level 3 command overview . . . . . . . . 11
Table 9. Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 10. Abbreviations and symbols . . . . . . . . . . . . . . . 12
Table 11. Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13
17. Figures
Fig 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Fig 2. Contact assignments for SOT500-2 (MOA4) . . . .4
Fig 3. Memory organization . . . . . . . . . . . . . . . . . . . . . . .5
MF1SPLUSX0Y1_SDS
Product short data sheet
PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.2 — 21 February 2011
187032
© NXP B.V. 2011. All rights reserved.
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