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NAND512-A2C 查看數據表(PDF) - Numonyx -> Micron

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NAND512-A2C Datasheet PDF : 51 Pages
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DC and AC parameters
NAND512-A2C
Table 19. DC Characteristics, 3V devices(1)
Symbol
Parameter
Test Conditions
IDD1
IDD2
IDD3
IDD4
IDD5
ILI
ILO
VIH
VIL
VOH
VOL
IOL (RB)
VLKO
Operating
Current
Sequential
Read
Program
Erase
Stand-by Current (TTL),
Stand-By Current (CMOS)
Input Leakage Current
Output Leakage Current
Input High Voltage
Input Low Voltage
Output High Voltage Level
Output Low Voltage Level
Output Low Current (RB)
VDD Supply Voltage (Erase and
Program lockout)
tRLRL minimum
E=VIL, IOUT = 0 mA
-
-
E=VIH, WP=0V/VDD
E=VDD-0.2, WP=0/VDD
VIN= 0 to VDDmax
VOUT= 0 to VDDmax
-
-
IOH = 400µA
IOL = 2.1mA
VOL = 0.4V
-
1. Leakage currents double on stacked devices.
Min
-
-
-
-
-
-
-
2.0
0.3
2.4
-
8
-
Typ
Max Unit
10
20
mA
10
20
mA
10
20
mA
-
1
mA
10
50
µA
-
±10 µA
-
±10 µA
-
VDD+0.3 V
-
0.8
V
-
-
V
-
0.4
V
10
mA
-
1.7
V
Table 20. AC characteristics for Command, Address, Data Input
Symbol
Alt.
Symbol
Parameter
1.8V
devices
3V
devices
Unit
tALLWH
Address Latch Low to Write Enable High
tALS
AL Setup time Min 25
tALHWH
Address Latch High to Write Enable High
tCLHWH
Command Latch High to Write Enable High
tCLLWH
tCLS
CL Setup time
Command Latch Low to Write Enable High
Min
25
tDVWH
tDS Data Valid to Write Enable High
Data Setup time Min 20
tELWH
tCS Chip Enable Low to Write Enable High
E Setup time Min 30
tWHALH
tWHALL
Write Enable High to Address Latch High
tALH
Write Enable High to Address Latch Low
AL Hold time
Min 10
tWHCLH
tWHCLL
Write Enable High to Command Latch High
tCLH
CL hold time
Write Enable High to Command Latch Low
Min 10
tWHDX tDH Write Enable High to Data Transition
Data Hold time Min 10
tWHEH tCH Write Enable High to Chip Enable High
E Hold time
Min 10
tWHWL tWH Write Enable High to Write Enable Low
W High Hold
time
Min 15
tWLWH
tWLWL
tWP Write Enable Low to Write Enable High
tWC Write Enable Low to Write Enable Low
W Pulse Width Min 25
Write Cycle time Min 45
15 ns
15 ns
15 ns
20 ns
5
ns
5
ns
5
ns
5
ns
10 ns
15 ns
30 ns
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