TDA8357 查看數據表（PDF） - Philips Electronics

零件编号

产品描述 (功能)

生产厂家

TDA8357

Full bridge vertical deflection output circuit in LVDMOS

Philips Electronics 

Philips Semiconductors

Full bridge vertical deflection output circuit

in LVDMOS

Preliminary specification

TDA8357J

Heatsink calculation

The value of the heatsink can be calculated in a standard

way with a method based on average temperatures.

The required thermal resistance of the heatsink is

determined by the maximum die temperature of 150 °C.

In general we recommend to design for an average die

temperature not exceeding 130 °C.

EXAMPLE

Measured or given values: Ptot = 3 W; Tamb = 40 °C;

Tj = 110 °C; Rth(j-c) = 5 K/W; Rth(c-h) = 2 K/W.

The required heatsink thermal resistance is given by:

Rth(h – a) = T----j---–-P----Tt--o-a-t--m----b- – (Rth(j – c) + Rth(c – h))

When we use the values given we find:

Rth(h – a) = 1----1---0-3---.-–-0----4---0-- – (5 + 2) = 16 K/W

The heatsink temperature will be:

Th = Tamb + (Rth(h-a) × Ptot) = 40 + (3 × 16) = 90 °C

1999 Nov 10

11

Share Link: