AD8176
Preliminary Technical Data
OUTLINE DIMENSIONS
27.20
27.00 SQ
26.80
A1 BALL
PAD CORNER
TOP VIEW
24.20
24.00 SQ
23.80
1.00
BSC
A1 CORNER
INDEX AREA
26 24 22 20 18 16 14 12 10 8 6 4 2
25 23 21 19 17 15 13 11 9 7 5 3 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
5.50
MAX
DETAIL A
2.00
MAX
DETAIL A
3.50
MAX
ORDERING GUIDE
Model
AD8176ABPZ1
AD8176-EVAL
1 Z = Pb-free part.
0.30
MIN
0.70
0.60
0.50
BALL DIAMETER
COMPLIANT TO JEDEC STANDARDS MS-034-AAL-1
Figure 29. 676-Lead Ball Grid Array, Thermally Enhanced [BGA_ED]
Dimensions shown in millimeters
COPLANARITY
0.20 MAX
SEATING
PLANE
Temperature Range
−40°C to +85°C
Package Description
676-Lead Ball Grid Array Package [BGA_ED] (27 × 27 mm)
AD8176 Evaluation Kit
Package Option
B-676
©2007 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
PR06596-0-1/07(PrA)
Rev. PrA | Page 32 of 32