AD8104 查看數據表（PDF） - Analog Devices
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AD8104 Datasheet PDF : 36 Pages
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AD8104/AD8105
OUTLINE DIMENSIONS
31.00
BSC SQ
BALL A1
INDICATOR
TOP VIEW
DETAIL A
27.94
BSC SQ
1.27
BSC
A1 CORNER
INDEX AREA
22 20 18 16 14 12 10 8 6 4 2
23 21 19 17 15 13 11 9 7 5 3 1
A
B
C
D
E
F
G
H
J
K
BOTTOM
L
VIEW
M
N
P
R
T
U
V
W
Y
AA
AB
AC
*1.765 MAX
0.10 MIN
0.25 MIN
(4 )
DETAIL A
0.90
0.75
0.60
BALL DIAMETER
1.07
0.99
0.92
0.70
0.63
0.56
SEATING
PLANE
COPLANARITY
0.20
*COMPLIANT TO JEDEC STANDARDS MO-192-BAN-2
WITH THE EXCEPTION TO PACKAGE HEIGHT.
Figure 74. 304-Ball Ball Grid Array, Thermally Enhanced [BGA_ED]
(BP-304)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
AD8104ABPZ1 −40°C to +85°C
AD8105ABPZ1 −40°C to +85°C
AD8104-EVAL
AD8105-EVAL
1 Z = RoHS Compliant Part.
Package Description
304-Ball Ball Grid Array Package, Thermally Enhanced [BGA_ED]
304-Ball Ball Grid Array Package, Thermally Enhanced [BGA_ED]
Evaluation Board
Evaluation Board
Package Option
BP-304
BP-304
©2007 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D06612-0-6/07(0)
Rev. 0 | Page 36 of 36
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