Philips Semiconductors
TFA9842AJ
7.5 W stereo power amplifier with volume control
15. Package outline
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad
SOT523-1
non-concave
x
q1
Eh
D
D1
P
k
q2
Dh
view B: mounting base side
A2
E
B
L3
L2
L
q
L1
1
9
Z
e1
wM
Q
c
vM
e
bp
0
5
10 mm
m
e2
DIMENSIONS (mm are the original dimensions)
scale
UNIT A2(2) bp c D(1) D1(2) Dh E(1) Eh e e1 e2 k L L1 L2 L3 m P Q q q1 q2 v w x Z(1)
mm
2.7
2.3
0.80 0.58 13.2
0.65 0.48 12.8
6.2
5.8
3.5
14.7
14.3
3.5 2.54 1.27 5.08
3
2
12.4 11.4 6.7
11.0 10.0 5.5
4.5
3.7
2.8
3.4 1.15 17.5 4.85 3.8
3.1 0.85 16.3
3.6
0.8
0.3
0.02
1.65
1.10
Notes
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2. Plastic surface within circle area D1 may protrude 0.04 mm maximum.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT523-1
EUROPEAN
PROJECTION
ISSUE DATE
00-07-03
03-03-12
Fig 17. Package outline SOT523-1 (DBS9P)
TFA9842AJ_1
Preliminary specification
Rev. 01 — 28 April 2006
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
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