BC57E687CGITBE4 查看數據表（PDF） - Unspecified
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BC57E687CGITBE4
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BC57E687CGITBE4 Datasheet PDF : 104 Pages
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Package Information
3.3 Package Dimensions
Top View
1 2 3 4 5 6 7 8 10 11 12 13 14 15
X
Y
Bottom View
15 14 13 12 11 10 8 7 6 5 4 3 2 1
PX
5
F
PY
E
E1 SE
e
G
D
0.2 Z 3
0.08 Z
Z 2 SEATING PLANE
A3
A2
A1
J
A
SD
D1
H
Scale = 1mm
Description
169-Ball Thin Fine-Pitch Ball Grid Array (TFBGA)
Size
8 x 8 x 1.2mm
Pitch
0.5mm
Package Ball Land Solder mask defined. Solder mask aperture 275μm Ø
Dimension
A
A1
A2
A3
b
D
E
e
D1
E1
F
G
H
J
PX
PY
SD
SE
X
Y
JEDEC
Minimum
0.16
0.27
7.90
7.90
MO-195
Typical
0.21
0.21
0.7
0.32
8.00
8.00
0.5
7.00
7.00
0.50
0.50
0.50
0.50
0.35
0.35
0.5
0.5
1.35
0.85
Maximum
1.2
0.26
0.37
8.10
8.10
Notes
1 Dimension b is measured at the maximum
solder ball diameter parallel to datum
plane Z
2 Datum Z is defined by the spherical
crowns of the solder balls
Parallelism measurement shall exclude
3 any effect of mark on top surface of
package
Top-side polarity mark. The dimensions of
4 the square polarity mark are 0.75 x
0.75mm.
Bottom-side polarity mark. The
5 dimensions of the triangular polarity mark
are 0.3 x 0.3 x 0.42mm.
Unit
mm
Figure 3.2: 169-ball TFBGA Package Dimensions
CS-121064-DSP4
Production Information
This material is subject to CSR's non-disclosure agreement
© Cambridge Silicon Radio Limited 2006 - 2010
Page 21 of 104
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