RHEF650-AP 查看數據表（PDF） - TE Connectivity

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RHEF650-AP

PolySwitch Resettable Devices

TE Connectivity 

Table R5 Physical Characteristics and Environmental Specifications for Radial-leaded Devices

BBRF

Physical Characteristics

Lead material

Tin-plated copper, 0.52mm2 (20AWG), ø0.81mm (0.032in.)

Soldering characteristics

Solderability per ANSI/J-STD-002 Category 3

Solder heat withstand

per IEC-STD 68-2-20, Test Tb, Method 1A, Condition B, can withstand 10 seconds at 260°C ±5°C

Insulating material

Cured, flame-retardant epoxy polymer; meets UL 94V-0

Operation temperature

-40°C~85°C

Note: Devices are not designed to be placed through a reflow process.

Environmental Specifications

Test

Passive aging

Humidity aging

Thermal shock

Solvent resistance

Conditions

70°C, 1000 hours

85°C, 1000 hours

85°C, 85%RH, 1000 hours

85°C, -40°C (10 times)

MIL-STD-202, Method 215F

Resistance Change

±5%

±5%

±5%

±5%

No change

12

150

RXEF

Physical Characteristics

Lead material

RXEF005

: Tin-plated nickel-copper alloy, 0.128mm2 (26AWG), ø0.40mm (0.016in.)

RXEF010

: Tin-plated nickel-copper alloy, 0.205mm2 (24AWG), ø0.51mm (0.020in.)

RXEF017 to 040 : Tin-plated copper-clad steel, 0.205mm2 (24AWG), ø0.51mm (0.020in.)

RXEF050 to 090 : Tin-plated copper, 0.205mm2 (24AWG), ø0.51mm (0.020in.)

RXEF110 to 375 : Tin-plated copper, 0.52mm2 (20AWG), ø0.81mm (0.032in.)

Soldering characteristics

Solderability per ANSI/J-STD-002 Category 3

RXEF005, RXEF010 meet ANSI/J-STD-002 Category 1

Solder heat withstand

RXEF005- RXEF025: per IEC-STD 68-2-20, Test Tb, Method 1a, condition a;

can withstand 5 seconds at 260°C ±5°C

All other sizes: per IEC-STD 68-2-20, Test Tb, Method 1a, condition b;

can withstand 10 seconds at 260°C ±5°C

Insulating material

Cured, flame-retardant epoxy polymer; meets UL 94V-0

Operation temperature

-40°C~85°C

Note: Devices are not designed to be placed through a reflow process.

Environmental Specifications

Test

Passive aging

Humidity aging

Thermal shock

Solvent resistance

Conditions

-40°C, 1000 hours

85°C, 1000 hours

85°C, 85%RH, 1000 hours

85°C, -40°C (10 times)

MIL-STD-202, Method 215F

Resistance Change

±5%

±5%

±10%

±10%

No change

RKEF

Physical Characteristics

Lead material

RKEF050 to 090 : Tin-plated copper, 0.205mm2 (24AWG), ø0.51mm (0.020in.)

RKEF110 to 500 : Tin-plated copper, 0.52mm2 (20AWG), ø0.81mm (0.032in.)

Soldering characteristics

Solderability per ANSI/J-STD-002 Category 3

Solder heat withstand

RKEF050-RKEF185 : per IEC-STD 68-2-20, Test Tb, Method 1a, condition a;

can withstand 5 seconds at 260°C ±5°C

All other sizes: per IEC-STD 68-2-20, Test Tb, Method 1a, condition b;

RKEF can withstand 10 seconds at 260°C ±5°C

Insulating material

Cured, flame-retardant epoxy polymer; meets UL 94V-0

Operation temperature

-40°C~85°C

Note: Devices are not designed to be placed through a reflow process.

RoHS Compliant, ELV Compliant

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