ALC5640VB 查看數據表（PDF） - Realtek Semiconductor

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ALC5640VB

Multi-Channel Audio Hub/CODEC and SounzReal Digital Sound Effect for Mobile Devices

Realtek Semiconductor 

11.2. Package Thermal Information

Table 153.

Parameter

Symbol

QFN48 (6x6) Thermal Impedance

(Junction to Case)

jc

QFN48 (6x6) Thermal Impedance

(Junction to Ambient)

ja

*Follow JEDEC PCB:

1. PCB Dimension (L x W): 114.3mm x 101.6mm

2. PCB Thickness: 1.6mm

3. Number of Cu Layer-PCB: 4-layers (2S2P)

4. PCB Via Number: 10

5. Air flow: 0 (m/s)

Thermal Information

Min

Typ

-

8.4

-

28

ALC5640-VB

Datasheet

Max

Units

-

oC/W

-

oC/W

Multi-Channel Audio Hub/CODEC and SounzRealTM

138

Digital Sound Effect for Mobile Devices

Rev. 0.91

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