XC6227C081 查看數據表（PDF） - TOREX SEMICONDUCTOR
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XC6227C081 Datasheet PDF : 25 Pages
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■PACKAGING INFORMATION (Continued)
● USP-6C Power Dissipation
Power dissipation data for the USP-6C is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as the reference data taken in the following condition.
1. Measurement Condition
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board:
Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
て
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
XC6227
Series
2. Power Dissipation vs. Ambient Temperature
Board Mount (Tj max = 125℃)
Ambient Temperature（℃）
25
85
Power Dissipation Pd（mW）
1000
400
Evaluation Board (Unit: mm)
Thermal Resistance (℃/W)
100.00
1200
1000
800
600
400
200
0
25
Pd-TaP特d 性vs.グTaラフ
45
65
85
105
125
Ambien周t Te辺m温pe度ratuTrae（: ℃Ta ）(℃)
21/25
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