MSP6469(2004) 查看數據表（PDF） - Microsemi Corporation
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产品描述 (功能)
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MSP6469
(Rev.:2004)
(Rev.:2004)
Microsemi Corporation
MSP6469 Datasheet PDF : 3 Pages
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SCOTTSDALE DIVISION
1N6469US thru 1N6476US
Voidless-Hermetically-Sealed Surface
Mount Unidirectional Transient
Suppressors
FIGURE 3
8/20 µs CURRENT IMPULSE WAVEFORM
T – Temperature – oC
FIGURE 4
DERATING CURVE
PACKAGE DIMENSIONS Inches [mm]
G-MELF-PKG (D-5C)
Note: If mounting requires adhesive separate from the solder,
an additional 0.090 inch diameter contact may be placed in the
center between the pads as an optional spot for cement as
shown in the pad layout.
Copyright 2004
11-01-2004 REV A
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 3
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