APR3101 查看數據表（PDF） - Anpec Electronics
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APR3101 Datasheet PDF : 14 Pages
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APR3101/2/3
Physical Specifications
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition (IR/Convection or VPR Reflow)
TP
tp
Critical Zone
R am p-up
TL to TP
TL
tL
Tsm ax
Tsm in
ts
Preheat
R am p-down
25
t 25 °C to Peak
Classificatin Reflow Profiles
Tim e
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Large Body
Small Body
Large Body
Small Body
Average ramp-up rate
(TL to TP)
Preheat
- Temperature Min (Tsmin)
- Temperature Mix (Tsmax)
- Time (min to max)(ts)
3°C/second max.
100°C
150°C
60-120 seconds
3°C/second max.
150°C
200°C
60-180 seconds
Tsmax to TL
- Temperature(TL)
- Time (tL)
Peak Temperature(Tp)
183°C
60-150 seconds
3°C/second max
217°C
60-150 seconds
Time within 5°C of actual Peak
Temperature(tp)
225 +0/-5°C
240 +0/-5°C
245 +0/-5°C 250 +0/-5°C
Ramp-down Rate
10-30 seconds 10-30 seconds 10-30 seconds 20-40 seconds
Time 25°C to Peak Temperature
6°C/second max.
6°C/second max.
6 minutes max.
8 minutes max.
Note: All temperatures refer to topside of the package. Measured on the body surface.
Copyright ANPEC Electronics Corp.
12
Rev. A.3 - Feb., 2004
www.anpec.com.tw
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