39LF020 查看數據表（PDF） - Silicon Storage Technology
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39LF020 Datasheet PDF : 24 Pages
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PACKAGING DIAGRAMS
512 Kbit / 1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39LF512 / SST39LF010 / SST39LF020 / SST39LF040
SST39VF512 / SST39VF010 / SST39VF020 / SST39VF040
Data Sheet
Optional
Pin #1 Identifier .042
.048
TOP VIEW
.485
.495
.447
.453
2 1 32
.020 R.
MAX.
SIDE VIEW
.106
.112
.023 x 30˚
.029
.030
.040
R.
BOTTOM VIEW
.042
.048
.585 .547
.595 .553
.013
.021
.026
.400 .490
.032
BSC .530
.050
BSC.
.050
BSC.
.015 Min.
.075
.095
.026
.125
.032
.140
Note:
1. Complies with JEDEC publication 95 MS-016 AE dimensions, although some dimensions may be more stringent.
2. All linear dimensions are in inches (min/max).
3. Dimensions do not include mold flash. Maximum allowable mold flash is .008 inches.
4. Coplanarity: 4 mils.
32.PLCC.NH-ILL.2
32-LEAD PLASTIC LEAD CHIP CARRIER (PLCC)
SST PACKAGE CODE: NH
Pin # 1 Identifier
1.05
0.95
.50
BSC
8.10
.270
.170
7.90
12.50
12.30
0.15
0.05
0.70
0.50
14.20
13.80
32.TSOP-WH-ILL.4
Note:
1. Complies with JEDEC publication 95 MO-142 BA dimensions, although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (min/max).
3. Coplanarity: 0.1 (±.05) mm.
4. Maximum allowable mold flash is 0.15mm at the package ends, and 0.25mm between leads.
32-LEAD THIN SMALL OUTLINE PACKAGE (TSOP) 8MM X 14MM
SST PACKAGE CODE: WH
©2001 Silicon Storage Technology, Inc.
22
S71150-03-000 6/01 395
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