DSP56F805 查看數據表（PDF） - Freescale Semiconductor

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DSP56F805

16-bit Digital Signal Controllers

Freescale Semiconductor 

General Characteristics

Table 3-2 Recommended Operating Conditions

Characteristic

Voltage difference VDD to VDDA

Voltage difference VSS to VSSA

ADC reference voltage

Ambient operating temperature

Symbol

Min

Typ

Max

Unit

ΔVDD

-0.1

ΔVSS

-0.1

VREF

2.7

TA

–40

-

0.1

V

-

0.1

V

–

VDDA

V

–

85

°C

Table 3-3 Thermal Characteristics6

Characteristic

Comments

Symbol

Value

144-pin LQFP

Unit Notes

Junction to ambient

Natural convection

Junction to ambient (@1m/sec)

Junction to ambient

Natural convection

Four layer board

(2s2p)

Junction to ambient (@1m/sec) Four layer board

(2s2p)

Junction to case

Junction to center of case

I/O pin power dissipation

Power dissipation

Junction to center of case

RθJA

RθJMA

RθJMA

(2s2p)

RθJMA

RθJC

ΨJT

P I/O

PD

PDMAX

47.1

°C/W 2

43.8

°C/W 2

40.8

°C/W 1,2

39.2

°C/W 1,2

11.8

°C/W 3

1

°C/W 4, 5

User Determined

W

P D = (IDD x VDD + P I/O)

W

(TJ - TA) /RθJA

W

7

Notes:

1. Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application.

Determined on 2s2p thermal test board.

2. Junction to ambient thermal resistance, Theta-JA (RθJA) was simulated to be equivalent to the JEDEC

specification JESD51-2 in a horizontal configuration in natural convection. Theta-JA was also simulated on

a thermal test board with two internal planes (2s2p where “s” is the number of signal layers and “p” is the

number of planes) per JESD51-6 and JESD51-7. The correct name for Theta-JA for forced convection or with

the non-single layer boards is Theta-JMA.

3. Junction to case thermal resistance, Theta-JC (RθJC ), was simulated to be equivalent to the measured values

using the cold plate technique with the cold plate temperature used as the “case” temperature. The basic cold

plate measurement technique is described by MIL-STD 883D, Method 1012.1. This is the correct thermal

metric to use to calculate thermal performance when the package is being used with a heat sink.

56F805 Technical Data, Rev. 15

Freescale Semiconductor

21

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