74LVC1G386(2007) 查看數據表（PDF） - NXP Semiconductors.
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74LVC1G386 Datasheet PDF : 12 Pages
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NXP Semiconductors
13. Package outline
Plastic surface-mounted package; 6 leads
D
B
74LVC1G386
3-input EXCLUSIVE-OR gate
SOT363
E
A
X
y
6
5
4
pin 1
index
1
2
e1
bp
e
3
wM B
HE
vM A
A
A1
Q
c
Lp
detail X
0
1
scale
2 mm
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
c
D
E
e
e1
HE Lp
Q
v
w
y
mm
1.1
0.8
0.1
0.30 0.25
0.20 0.10
2.2
1.8
1.35
1.15
1.3
0.65
2.2
2.0
0.45 0.25
0.15 0.15
0.2
0.2
0.1
OUTLINE
VERSION
IEC
SOT363
REFERENCES
JEDEC
JEITA
SC-88
Fig 7. Package outline SOT363 (SC-88)
74LVC1G386_2
Product data sheet
Rev. 02 — 3 September 2007
EUROPEAN
PROJECTION
ISSUE DATE
04-11-08
06-03-16
© NXP B.V. 2007. All rights reserved.
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