A3983
DMOS Microstepping Driver with Translator
THERMAL CHARACTERISTICS may require derating at maximum conditions, see application information
Characteristic
Package Thermal Resistance
Symbol
RθJA
Test Conditions*
Value Units
One-layer PCB, one-sided with copper limited to solder pads
100 ºC/W
One layer PCB, two-sided with copper limited to solder pads and
3.8 in.2 of copper area on each side, connected to GND pins
High-K PCB (multilayer with significant copper areas, based on
JEDEC standard)
32 ºC/W
28 ºC/W
*In still air. Additional thermal information available on Allegro Web site.
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
20
Maximum Power Dissipation, PD(max)
(RθLJoAw=-(KR3θHJ2PAiCgºC=hB-/2KW8P)ºCCB/W)
(MRθiJnAim=u1m0-0KºPCC/WB)
40 60 80 100 120 140 160 180
Temperature (°C)
26184.29A
Allegro MicroSystems, Inc.
4
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com