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ACPM-7392 查看數據表(PDF) - Avago Technologies

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ACPM-7392 Datasheet PDF : 18 Pages
First Prev 11 12 13 14 15 16 17 18
Reflow Profile Recommendations
Tp
TL
Ts max
Ts min
ts
Preheat
Ramp-up
tp
tL
Critical Zone
T L to Tp
Ramp-down
25
t 25oC to Peak
Time
Typical SMT Reflow Profile for Maximum Temperature = 260 +0/ -5°
Profile Feature
Average ramp-up rate (TL to TP)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
Tsmax to TL
- Ramp-up Rate
Time maintained above:
- Temperature (TL)
- Time (TL)
Peak temperature (Tp)
Time within 5° of actual Peak Temperature (tp)
Ramp-down Rate
Time 25° to Peak Temperature
Sn-Pb Solder
3°/sec max
100°
150°
60-120 sec
183°
60-150 sec
240 +0/-5°
10-30 sec
6° /sec max
6 min max.
Pb-Free Solder
3° /sec max
150°
200°
60-180 sec
3° /sec max
217°
60-150 sec
260 +0/-5°
20-40 sec
6° /sec max
8 min max.
15

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