ACST12 查看數據表（PDF） - STMicroelectronics
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ACST12 Datasheet PDF : 12 Pages
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ACST12
Characteristics
Figure 12. Relative variation of critical rate of
decrease of main current vs.
junction temperature
(dI/dt)c[Tj] / (dI/dt)c[Tj=125°C]
11
10
9
8
7
6
5
4
3
2
1
Tj(°C)
0
25
50
75
100
125
Figure 13. Relative variation of static dV/dt
immunity vs. junction temperature
dV/dt[Tj] / dV/dt[Tj=125°C]
12
11
VD=VR=400 V
10
9
8
7
6
5
4
3
2
1
Tj(°C)
0
25
50
75
100
125
Figure 14. Relative variation of maximum
clamping voltage, VCL vs. junction
temperature
VCL[TJ/VCL[TJ = 25 °C]
1.15
1.10
1.05
Figure 15. Variation of thermal resistance
junction to ambient vs. copper
surface under tab
Rth(j-a)(°C/W)
80
70
Epoxy printed circuit board
FR4, copper thickness = 35 µm
D²PAK
60
50
1.00
40
Minimum values
30
0.95
20
0.90
10
TJ(°C)
0.85
0
-50
-25
0
25
50
75
100
125
0
SCU(cm²)
5
10
15
20
5/12
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